中文
Customer Feedback
Customer Feedback
We take our customers' feedback seriously. Any suggestions will be reviewed by our team, including engineering, quality, sales, and production staff, and appropriate action will be taken.
R&D
R&D
Providing high-quality, lower-cost materials to customers in high-tech industries. Growing together with customers through shared R&D.
Precision machining & processing technology
Precision machining & processing technology
We have a number of top domestic and foreign CNC lathes, machining centers and other large-scale precision processing equipment, which can accurately control the various dimensions of the target materials, thereby meeting the sputtering requirements of different high-end customers around the world.
Grain size and orientation directly determine the uniformity and speed of sputtering film formation, impacting the quality and performance of downstream products. Therefore, controlling grain orientation is a core technology in sputtering target production. The company boasts a metal material plastic deformation processing line and in-house structural testing equipment. Through scientific process planning, we are able to precisely control grain orientation.
Because impurities in metal materials can affect the conductivity of downstream products such as semiconductor chips, sputtering targets place extremely high demands on metal purity. Through independent research and development and collaborative development, the company has acquired the technical capability to produce ultra-high-purity metal materials for sputtering targets, significantly enhancing its market competitiveness.
Welding technology securely joins the target blank to the backing plate. The company boasts comprehensive production lines and advanced technologies for various welding methods, including diffusion welding, electron beam welding, and brazing. The company boasts an average welding bond rate exceeding 99%, meeting the diverse needs of diverse customers. Through years of independent research and development, the company has mastered diffusion welding technology for large-scale, high-bond rate, and high-strength targets and backing plates, including Al, Ti, Ta, and Cu.
The sputtering machines used by semiconductor chip manufacturing customers are very sophisticated and have very high requirements for the dimensional accuracy of the sputtering targets. The company has a number of top domestic and foreign CNC lathes, machining centers and other large-scale precision processing equipment, which can accurately control the various dimensions of the target materials, thereby meeting the sputtering requirements of different high-end customers around the world.
The production environment of downstream customers and the sputtering reaction machine cavity have very high requirements for the cleanliness of sputtering targets. The company uses its independently designed fully automatic target cleaning machine to repeatedly clean products and dry the products in a vacuum environment. The surface cleanliness of sputtering targets used in the production of semiconductor chips can reach electronic grade levels.
